The RM300 test unit provided by Jandel, combined with an adjustable height stand probe, can provide solutions for a variety of measurements.
This combination is currently the most popular product of Jandel.
The system can be used to measure various thin layers of small-size samples and wafer ingots with a diameter of 300mm and a height of 250mm (please consult before testing thick samples).
Can measure the diameter of the chip
D≤250mm, (optional D≤300mm, free of charge)
Can measure chip thickness
H≤250mm, (can be thicker, please consult)
Micro switch
Prevents current from flowing when the probe is not in contact with the sample
Manual control
Simple lever operation for probe contact and movement
Easy to assemble
RM300 and four-probe probe are connected via a single line
System Configuration
Components:
1.Test bench - one
2. Height-adjustable mainframe - one
3. Adjustable height shaft rod - one
4.Four-probe probe - one
5.Connecting cable - one
Device size:
Adjustable height test bench: W×L×H (mm) 250×290×8 (320×370×8, optional)
