The step meter is a contact-type surface topography measuring instrument. Its measuring principle is: when the stylus slides gently along the measured surface, the stylus moves up and down along the peaks and valleys due to the tiny peaks and valleys on the surface. The movement of the stylus reflects the surface profile. After the electrical signal output by the sensor passes through the measuring bridge, it outputs an amplitude modulation signal proportional to the displacement of the stylus from the equilibrium position. After amplification and phase-sensitive rectification, the displacement signal can be demodulated from the amplitude modulation signal to obtain an amplified slowly changing signal proportional to the displacement of the stylus. The noise filter and waviness filter further filter out the influence of the modulation frequency, external interference signals, and waviness on the roughness measurement.
According to the different sensors used, contact step measurement can be divided into three types: inductive, piezoelectric and photoelectric. The inductive type uses an inductive displacement sensor as a sensitive element, with high measurement accuracy and high signal-to-noise ratio, but the circuit processing is complex; the piezoelectric displacement sensitive element is a piezoelectric crystal, which has high sensitivity and simple structure, but the sensor has poor low-frequency response and is prone to leakage, causing measurement errors; the photoelectric type uses a photoelectric element to receive changes in the light flux passing through the slit to detect changes in displacement.
The step gauge has high measurement accuracy, large measurement range, stable and reliable measurement results, good repeatability, and can also be used as a comparison for other topography measurement technologies. However, it also has its shortcomings that are difficult to overcome: 1. Due to the deformation and wear of the probe caused by the contact between the probe and the measured object, the measurement accuracy of the instrument decreases after a period of use; 2. In order to ensure wear resistance and rigidity, the probe cannot be made very small and sharp. If the radius of curvature of the probe head is larger than the radius of the microscopic pit on the measured surface, it will inevitably cause deviation in the measurement data at that location; 3. In order to prevent the probe from wearing out quickly, the hardness of the probe is generally very high, so it is not suitable for the measurement of precision parts and soft surfaces.
200 Micro-Shape Measuring Machine (Probe Contact Step Meter) Kosaka Research Institute Co., Ltd. (KOSAKA) was established in 1950
The company was founded in 1999 and is the first company in Japan to publish an optical stem lever surface roughness meter. It is a professional manufacturer with a long history and technical background. It mainly has three departments: measurement/automation/fluid. The XP operating system provides comprehensive topography analysis for a variety of different surfaces, including semiconductor silicon wafers, solar silicon wafers, thin film heads and disks, MEMS, optoelectronics, precision machining surfaces, biomedical devices, thin film/chemical coatings, and flat panel displays. The diamond probe contact measurement method is used to achieve high-precision surface topography analysis applications.
Product Name
Product Introduction
Product Number
KOSAKA Step Meter
Equipped with various types of probes, it provides probes that can control contact force and vertical range through programs. The color CCD in-situ acquisition design can directly observe the working status of the probe, making it more convenient and accurate to locate the test area.
Kosaka ET200 Step Meter
KOSAKA Co., Ltd. was founded in 1950 and was the first company in Japan to publish an optical lever surface roughness meter. It is a professional manufacturer with a long history and technical background. It mainly has three major departments: measurement/automatic/fluid. Among them, the measurement department is the most representative unit and has an irreplaceable position in Japan's precision measurement.
KOSAKA ET200 provides comprehensive morphology analysis for various surfaces based on Windows XP operating system, including semiconductor silicon wafers, solar silicon wafers, thin film heads and disks, MEMS, optoelectronics, precision machining surfaces, biomedical devices, thin film/chemical coatings, and flat panel displays. Diamond (diamond) probe contact measurement is used to achieve high-precision surface morphology analysis applications. ET200 can accurately and reliably measure surface step morphology, roughness, waviness, wear, film stress and other surface morphology technical parameters.
ET200 is equipped with various types of probes, providing probes that can control contact force and vertical range through programs. The color CCD in-situ acquisition design can directly observe the working status of the probe, making it more convenient and accurate to locate the test area.
Features:
Second dimension surface analysis, can measure step difference
High precision, high resolution and good reproducibility
FPD Panel display, can measure fine surface shape, step difference, roughness, etc.
Low measuring force, can measure soft materials
Technical parameters:
model
ET200
Maximum sample size
φ160x48mm
Sample stage
size
φ160
Tilt
± 2 °（ X,Y Manual
Load-bearing
2Kg
Detector
Stylus force
10μN-500μN （ 1mg-50mg ）
scope
600μm （ 0.1nm Resolution
drive
Direct acting (differential transformer)
Contact pin
R2μm Top Angle 60 °
X axis
Maximum length
100mm
Straightness
0.02μm/100mm
speed
0.005-20mm/s
Repeatability
±5μm (position)
Y axis
Maximum length
25mm / Manual
Z axis
Maximum length
50mm
Magnification
vertical
50-2000000
level
1-10000
Monitoring system
Camera device
1/3 inch CCD
Monitoring device
Video Capture Board
Mobile method
Manual
Accessibility
Teaching, motorized tilt, tilt analysis, detector automatic stop function, etc.
Best recipe search for pre-processing machines (such as exposure machines, sputtering machines, and etching machines). For example: PVD, CVD, DLC vacuum sputtering thin film steps, stress testing, and thin film step measurements for soft photoresist materials.
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