With the help of a specific light source and infrared detector, the RS-NIR-980 infrared flaw detector can penetrate a silicon block at a depth of 200mm. Pure silicon material hardly absorbs wavelengths in this band, but if there are particles, inclusions (usually SiC), or hidden cracks in the silicon block, these impurities will absorb infrared light and will appear in the imaging system. Moreover, these images will be automatically generated into three-dimensional model images through our software.
The polysilicon infrared flaw detector is mainly composed of an infrared light source, a rotating table, and an imaging system. The parameter settings of the imaging system include light brightness, contrast, gamma rays, and integrated time settings, acquisition mode selection, and damaged pixel management. The rotating table is driven by a single-axis servo motor and has the function of position inspection of a photoelectric encoder. The software can also directly control the servo motor.
Usually, infrared flaw detection is performed after the silicon block is cleaned and before the wire cutting. Infrared flaw detection before wire cutting can not only reduce wire marks, but also reduce SiC wire breakage, greatly improving efficiency. These inclusions can be clearly reflected in our infrared flaw detection system. Repairing broken wires is a time-consuming and laborious task, and not all broken wires can be successfully repaired. Therefore, it is an indispensable tool in the production of multicrystalline silicon wafers.
Features:
■ Provides a powerful monitoring tool for quality control in the solar multicrystalline silicon wafer process
■ Fast detection speed, the average detection time for each silicon block is no more than 1 minute
■ NIRVision software can analyze the 4-sided flaw detection results and directly convert the results into 3D model images
■ The imaging process will automatically mark the location of the inclusion
■ The unique enhanced interpolation method provides a strong technical guarantee for high-resolution impurity flaw detection
■ Made of European CNC engineering aluminum alloy material
■ The surface is protected by high-strength paint and electro-oxidation process
■ The system frame adopts high-quality industrial design
■ All components are designed to meet the requirements of long-term intensive use and minimum maintenance
■ The machine can conduct comprehensive flaw detection on the front, back, left, right, top and bottom surfaces of the silicon block through automatic or manual rotation.
■ The infrared light source is controlled by AC and DC light sources, and the light intensity can be directly controlled by software. It also has an overheat protection function.
■ At the same time, the software includes the management and analysis function of impurity images
■ Excellent stability and durability.
■ The test surface is preferably polished, so we recommend infrared testing before wire cutting.
■ The infrared imaging light source is affected by resistivity. The lower the resistivity of the silicon block, the more it absorbs infrared light.
■ Generally, the resistivity cannot be lower than 0.5Ohm*Cm. We recommend a resistivity of 0.8Ohm*Cm or higher.
Technical indicators:
■ Main detection indicators: inclusions (usually SiC), hidden cracks, particles, etc.
