Thin Film Stress & Wafer Bow (Warp) Test System Film Stress & Wafer Bow Measurement System
After thin film deposition, as the temperature decreases, stress and bending (warping) occur due to the difference in thermal expansion coefficients between the substrate and the film. FSM integrates the world's leading non-destructive laser scanning technology, scanning 40 data points per millimeter, and can quickly produce 2D and 3D color images.
Room temperature system
FSM 128
Maximum sample diameter 200mm
FSM 128L
Maximum sample diameter 300mm
FSM 128G
Maximum sample size: 550×650mm
Variable Temperature System
FSM 500TC
Resistance heating table: temperature controllable, up to 500℃
FSM 900TC-vac
RTP chamber: temperature controllable, up to 900°C (optional 1100°C); vacuum up to 1E-6 Torr
Shanghai Sales + Technical Support + After-sales Service Center Rayscience Optoelectronic Innovation Co., Ltd address: 4th Floor, Building 122, Lane 2338, No. 1 Duhui Road, Minhang District, Shanghai Telephone: 021-34635258 021-34635259 fax: 021-34635260 E-mail: saleschina@rayscience.com
