Solar cell laser processing system

This ultrafast laser photovoltaic cell laser processing system is a complete laser processing system designed specifically for solar energy research and development and the photovoltaic industry. Photovoltaic cell laser processing, removal of silicon nitride film, silicon nitride film etching, wafer edge isolation , which can be used as Laser film engraving machine, laser scribing machine use.

This photovoltaic cell laser processing system ( Laser film engraving machine, laser scribing machine) Using the most advanced ultraviolet femtosecond laser and infrared nanosecond laser, we can provide the following four-in-one services at the same time:

— Photovoltaic cell laser processing SiNx/SiO2 Removal, Removal of Silicon Dioxide, Removal of Silicon Nitride

— Femtosecond laser ablation Back contact laser sintering and laser grooving

— Photovoltaic cell laser processing Laser marking

— Photovoltaic cell laser processing Seconds laser ablation Edge isolation wafer

Ultraviolet femtosecond laser is used for SiNx/SiO2 Selective ablation or resection ( Silicon nitride film etching ), equipped with ultraviolet femtosecond laser can ablate very precisely SiNx( Removal of silicon nitride film ), At the same time Si The direct or thermal effect of the layer is reduced to a minimum, thereby increasing the carrier lifetime (minority carrier lifetime) and avoiding microcracks. 1064nm Nanosecond lasers work very stably and quickly and will be used for fast lasers on wafers. Edge Isolation , laser marking and Laser Sintering .
Should Photovoltaic cell wafer laser processing ( Laser engraving machine ) The system is equipped with automatic processing and scanning system to support 5'' and 6'' Diameter silicon wafer processing. Photovoltaic cell wafer laser processing ( Laser engraving machine ) It is also equipped with a mechanical vision system to adjust the laser beam scanning at any time to maintain Photovoltaic cell wafer laser processing ( Laser engraving machine ) High repeatability and reliability of the system.

Should Photovoltaic cell wafer laser processing ( Laser engraving machine ) System Configuration 1 The laser-grade protective device and dust elimination system are installed to create a dust-free processing environment to ensure the precision ablation of the femtosecond laser and minimize the influence of thermal effects.

feature

• Photovoltaic cell wafer laser processing ( Laser engraving machine ) Equipped with laser processing capabilities up to 800 Chip / Hours or 350000px/s
• Photovoltaic cell wafer laser processing ( Laser engraving machine ) The processing volume is 425 Chip / hours, after optimization, it can be used in the production line of 2.5MW/a products
• Photovoltaic cell wafer laser processing ( Laser engraving machine ) Applicable 5'' and 6'' Silicon Wafer
• Laser engraving machine Ultraviolet femtosecond laser and infrared nanosecond laser light sources
• Laser engraving machine Mechanical viewing system to adjust the laser scanning field
• Laser engraving machine Precision laser beam positioning
• Laser engraving machine Laser Scribing Laser Ablation Laser Melting

Successful Experience

• Laser engraving machine Provide users with silver-free metallization technology to produce solar cells;
• Laser engraving machine Successfully assembled to production capacity up to 2.5MWp/a on the production line.

This set Laser engraving machine The system uses a femtosecond laser to selectively remove the dielectric layer (SiNx) from the emitter of the wafer. The SiNx thickness is 50-90nm, covering the emitter, and must be removed accurately without damaging the emitter layer. One application is to ablate the SiNx layer while also producing bus bars and fingers openings. In the next step, these openings will be covered with nickel, thus forming a high-quality front contact. This system uses a galvanometer scanner to control the laser beam to cut the emitter, and the unique mechanical view function can detect the wafer position.