We focus on the research and application of ultrafast lasers and are the first in the world to develop mature Femtosecond laser micromachining system , bringing ultrafast lasers out of the laboratory. Femtosecond laser system, femtosecond laser processing system price, laser microstructuring, laser refractive index change, solar panel laser processing, 3D multiphoton polymerization, photolithography, femtosecond laser scribing, UV laser microprocessing
This set Femtosecond laser micromachining system It is specially designed for the laboratories of scientific research institutions, equipped with a linear positioning platform with nanometer precision and resolution, an ultra-high performance scanning galvanometer and multi-functional control software.
The parameter configuration of the standard system we provide is laser pulse width <200fs--10ps, repetition frequency 1-1000KHz, average power up to 12W, wavelength 1030nm, 515nm, 343nm, 258nm.
feature:
* High-speed micromachining
* Sub-micron resolution for difficult objects
× Femtosecond micromachining mode minimizes thermal impact on the processing area
* Nanometer precision positioning
* Precision laser beam transmission system
* Very convenient to change laser parameters
* Software controls all hardware fly
Software control functions:
* Control XYZ positioning platform
*Control the scanning galvanometer
* Control laser parameters
* Control mechanical view
* Polarization state
* Control the laser power in the working area
application
* Surface microstructure processing, micro-nanostructure processing, microstructure construction, micro-nanostructure construction;
* Changes in the refractive index of transparent materials;
* Solar panel processing;
* 2.5D Milling * Three-dimensional multiphoton polymerization; * Photolithography;
* Laser scribing
Strong advantages of the whole system:
* 4 wavelength laser light sources with up to 4 times the frequency
* Change focusing optics
* Positioning and focusing the beam
× Automatically focus the beam onto the sample surface
* Automatically confirm the tilt of the sample
* Imaging monitoring of the processing process
Standard configuration parameters
| Beam shaping and steering | Pulse Pickup | Built-in, automatic control |
| Galvanometer scanning (customizable) | Scanning speed up to 10m/s 5x5 | |
| Focusing optics | Use high numerical aperture spherical lens or objective lens with focal length of 1.45--18.4mm | |
| Monitoring CCD (customizable) | 1920x1080 pixels 16-bit output | |
| Positioning platform | type | XYZ, linear motor, roller bearing type or air bearing type |
| Maximum displacement speed | 350mm/s | |
| Work Area | 160x160mm | |
| Resolution | 1nm | |
| Positioning accuracy | +/-300nm | |
| Repeatability | +/-50nm | |
| Positioning as qualitative | 3nm | |
| Sample fixture | Vacuum chuck | |
| Laser parameters | Laser working material | Yb:KGW |
| Laser wavelength | 1028nm+/-5nm | |
| power | 4W (6W, 8W, 10W optional) | |
| Oscillator output power | 0.7-1.5W | |
| Pulse Energy | Max. 1mJ | |
| Repetition frequency | 200KHz (600KHz, 1000KHz optional) | |
| Pulse Width | <200fs---10ps variable, oscillator <80fs | |
| Beam quality | M2<1.2 | |
| Output pulse stability | <1% RMS | |
| Frequency Multiplier | type | SH(515nm), TH(343nm), FH(258nm) to be selected |
| Conversion efficiency@200KHz | >50% SH, >30% TH, >10% FH, | |
| Features | Laser beam steering function | Laser output, motorized attenuation of laser energy |
| Positioning platform control | 2.5K micromachining, 3DXYZ commands | |
| Control interface | Software window, Virtual or GUI handle | |
| Image Format | bmp, plt | |
| Workstation size | Size (WxDxH) | 1.2x1.8x2m (with outer shell) |
| weight | Maximum weight 500Kg (with casing) | |
| Work environment requirements | Power needs | 3-4KW |
| Ambient temperature | 15-30℃ | |
| Relative humidity | 20-80% | |
| Laser safety level | Level I |
