Laser scribing machine
Laser scribing machine
1. Basic technical index
1.1 Device parameter list
|
Laser Laser |
1064nm fiber laser 1064nm fiber laser |
|
Beam quality Laser beam quality |
1.3 |
|
Workbench travel Table travel |
300mm*300mm |
|
Maximum dicing speed Maximum scribing speed |
600mm/s |
|
Maximum idling speed Maximum empty speed |
600mm/s |
|
Slicing accuracy Scribing accuracy |
≤0.02mm |
|
Cooling system Cooling system |
Air Cooling Air cooling |
|
Line width Scribing width |
≤0.03mm |
|
Slicing table Scribing table |
Glass countertop Glass table |
|
Cell/silicon size |
125x125-230x230 whole piece, non-standard piece, rice piece, missing corner piece 125x125-230x230 |
|
Input voltage Input voltage |
220VAC/50HZ |
|
Power consumption Overall power consumption |
1KW |
|
Device size Equipment size |
860x670x1255mm |
|
weight Weight |
250KG (including packaging) 250KG(including packaging) |
1.2 Process parameter
|
project I tem |
parameter P arameters |
|
Slice size Scribing size |
User-defined User-defined |
|
Dicing parameters Scribing parameter |
Speed: 600mm/s Power: 160-200 Frequency: 120-160kHz Speed:600mm/s Power:160-200 Frequency:120-160kHz |
1.3 Quality standard
|
project Item |
parameter Parameters |
|
Slice Depth Depth of scribing |
0.05-0.07mm |
|
Comprehensive dicing accuracy Comprehensive scratching accuracy |
≤0.02mm |
|
Edge cutting quality Quality of cutting edge |
Smooth without cracks Smooth without cracks |
2. Choose the brand of electrical components
|
Serial number Serial number |
Electrical parts name Name of electrical component |
Manufacturer and model Manufacturer and model |
|
1 |
Control System Control system |
Independent research and development Independent research and development |
|
2 |
Modules Modules |
Chuangfeng Module Chuang Feng Modules |
|
3 |
Host Computer |
i3 CPU |
|
4 |
monitor Display |
Domestic |
|
5 |
Servo Motor Servo motor |
Domestic |
3. Electrical control system
The control system of the equipment should be controlled by a dedicated motion control card, operated by the host computer software, simple to operate, easy to learn and use. Equipment safety protection measures should be taken for accessories and all auxiliary facilities.
The control system of the equipment should be controlled by a special motion control card and operated by the upper computer software, which is simple to operate and easy to learn and use. Annex and all ancillary facilities shall take equipment safety precautions.
4. Equipment interface requirements
Power supply (provided by the user): working voltage 220V, 50HZ, 1KW
Power supply (provided by user): working voltage 220V, 50HZ, 1KW
Application areas
In the solar photovoltaic industry, monocrystalline silicon, polycrystalline silicon and amorphous silicon solar cells and silicon wafers are processed by dicing.
·Features
It uses krypton lamp pumped (YAG) laser, acousto-optic modulation system, CNC XY motion table and stepper motor drive;
The system adopts the internationally popular modular design, and key components are all imported products;
The equipment is highly reliable, precise and efficient;
The software has been upgraded to version 3.0 and installation and relocation are simple and convenient;
High-precision integrated constant temperature circulating water cooling; stable and reliable operation for a long time;
